chip beam-lead bonding

lustų sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip beam-lead bonding vok. Bonden von Kristallen mit Balken-Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre-puce, f

Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. . 2000.

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  • Bonden von Kristallen mit Balken-Anschlüssen — lustų sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip beam lead bonding vok. Bonden von Kristallen mit Balken Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre puce …   Radioelektronikos terminų žodynas

  • connexion poutre-puce — lustų sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip beam lead bonding vok. Bonden von Kristallen mit Balken Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre puce …   Radioelektronikos terminų žodynas

  • lustų sijinių išvadų prijungimas — statusas T sritis radioelektronika atitikmenys: angl. chip beam lead bonding vok. Bonden von Kristallen mit Balken Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre puce, f …   Radioelektronikos terminų žodynas

  • присоединение кристаллов ИС к балочным выводам — lustų sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip beam lead bonding vok. Bonden von Kristallen mit Balken Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre puce …   Radioelektronikos terminų žodynas

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